 |
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
| Datasheet File OCR Text: |
| ZXMD63N03X DUAL 30V N-CHANNEL ENHANCEMENT MODE MOSFET SUMMARY V(BR)DSS=30V; RDS(ON)=0.135 ; ID=2.3A DESCRIPTION This new generation of high density MOSFETs from Zetex utilizes a unique structure that combines the benefits of low on-resistance with fast switching speed. This makes them ideal for high efficiency, low voltage, power management applications. MSOP8 FEATURES * Low on-resistance * Fast switching speed * Low threshold * Low gate drive * Low profile SOIC package D2 D1 APPLICATIONS * DC - DC converters * Power management functions * Disconnect switches * Motor control G2 S2 G1 S1 Pin-out ORDERING INFORMATION DEVICE ZXM63N03NXTA ZXM63N03NXTC REEL SIZE (inches) 7 13 TAPE WIDTH (mm) 12 embossed 12 embossed QUANTITY PER REEL 1,000 4,000 S1 G1 S2 G2 1 D1 D1 D2 D2 Top view DEVICE MARKING ZXM63N03 ISSUE 1 - OCTOBER 2005 1 SEMICONDUCTORS ZXMD63N03X ABSOLUTE MAXIMUM RATINGS PARAMETER Drain-Source Voltage Gate- Source Voltage Continuous Drain Current (V GS =4.5V; T A =25C)(b)(d) I D (V GS =4.5V; T A =70C)(b)(d) Pulsed Drain Current (c)(d) I DM Continuous Source Current (Body Diode)(b)(d) IS Pulsed Source Current (Body Diode)(c)(d) Power Dissipation at T A =25C (a)(d) Linear Derating Factor Power Dissipation at T A =25C (a)(e) Linear Derating Factor Power Dissipation at T A =25C (b)(d) Linear Derating Factor Operating and Storage Temperature Range I SM PD PD PD T j :T stg 2.3 1.8 14 1.5 14 0.87 6.9 1.04 8.3 1.25 10 -55 to +150 A A A A W mW/C W mW/C W mW/C C SYMBOL V DSS V GS LIMIT 30 20 UNIT V V THERMAL RESISTANCE PARAMETER Junction to Ambient (a)(d) Junction to Ambient (b)(d) Junction to Ambient (a)(e) SYMBOL R JA R JA R JA VALUE 143 100 120 UNIT C/W C/W C/W NOTES: (a) For a device surface mounted on 25mm x 25mm FR4 PCB with high coverage of single sided 1oz copper, in still air conditions (b) For a device surface mounted on FR4 PCB measured at t 10 secs. (c) Repetitive rating - pulse width limited by maximum junction temperature. Refer to Transient Thermal Impedance graph. (d) For device with one active die. (e) For device with two active die running at equal power. ISSUE 1 - OCTOBER 2005 2 SEMICONDUCTORS ZXMD63N03X CHARACTERISTICS ISSUE 1 - OCTOBER 2005 3 SEMICONDUCTORS ZXMD63N03X ELECTRICAL CHARACTERISTICS (at Tamb = 25C unless otherwise stated) PARAMETER STATIC Drain-Source Breakdown Voltage Zero Gate Voltage Drain Current Gate-Body Leakage Gate-Source Threshold Voltage Static Drain-Source On-State Resistance (1) Forward Transconductance (3) DYNAMIC (3) Input Capacitance Output Capacitance Reverse Transfer Capacitance SWITCHING (2) (3) Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Total Gate Charge Gate-Source Charge Gate Drain Charge SOURCE-DRAIN DIODE Diode Forward Voltage (1) Reverse Recovery Time (3) Reverse Recovery Charge(3) V SD t rr Q rr 16.9 9.5 0.95 V ns nC T j =25C, I S =1.7A, V GS =0V T j =25C, I F =1.7A, di/dt= 100A/s t d(on) tr t d(off) tf Qg Q gs Q gd 2.5 4.1 9.6 4.4 8 1.2 2 ns ns ns ns nC nC nC V DS =24V,V GS =10V, I D =1.7A (Refer to test circuit) V DD =15V, I D =1.7A R G =6.1, R D =8.7 (Refer to test circuit) C iss C oss C rss 290 70 20 pF pF pF V DS =25 V, V GS =0V, f=1MHz V (BR)DSS I DSS I GSS V GS(th) R DS(on) g fs 1.9 1.0 0.135 0.200 30 1 100 V A nA V S I D =250A, V GS =0V V DS =30V, V GS =0V V GS = 20V, V DS =0V I =250A, V DS = V GS D SYMBOL MIN. TYP. MAX. UNIT CONDITIONS V GS =10V, I D =1.7A V GS =4.5V, I D =0.85A V DS =10V,I D =0.85A NOTES: (1) Measured under pulsed conditions. Width=300s. Duty cycle (R)2% . (2) Switching characteristics are independent of operating junction temperature. (3) For design aid only, not subject to production testing. ISSUE 1 - OCTOBER 2005 4 SEMICONDUCTORS ZXMD63N03X TYPICAL CHARACTERISTICS ISSUE 1 - OCTOBER 2005 5 SEMICONDUCTORS ZXMD63N03X TYPICAL CHARACTERISTICS ISSUE 1 - OCTOBER 2005 6 SEMICONDUCTORS ZXMD63N03X PACKAGE DETAILS e c PAD LAYOUT DETAILS 1.02 0.040 E E1 4.8 0.189 R1 D L R A2 A mm inches 0.41 0.016 0.65 0.023 b A1 PACKAGE DIMENSIONS DIM Millimeters MIN A A1 B C D e e1 E H L 0.91 0.10 0.25 0.13 2.95 MAX 1.11 0.20 0.36 0.18 3.05 MIN 0.036 0.004 0.010 0.005 0.116 Inches MAX 0.044 0.008 0.014 0.007 0.120 0.65NOM 0.33NOM 2.95 4.78 0.41 0 3.05 5.03 0.66 6 0.0256 0.0128 0.116 0.188 0.016 0 0.120 0.198 0.026 6 (c) Zetex Semiconductors plc 2005 Europe Zetex GmbH Streitfeldstrae 19 D-81673 Munchen Germany Telefon: (49) 89 45 49 49 0 Fax: (49) 89 45 49 49 49 europe.sales@zetex.com Americas Zetex Inc 700 Veterans Memorial Hwy Hauppauge, NY 11788 USA Telephone: (1) 631 360 2222 Fax: (1) 631 360 8222 usa.sales@zetex.com Asia Pacific Zetex (Asia) Ltd 3701-04 Metroplaza Tower 1 Hing Fong Road, Kwai Fong Hong Kong Telephone: (852) 26100 611 Fax: (852) 24250 494 asia.sales@zetex.com Corporate Headquarters Zetex Semiconductors plc Zetex Technology Park Chadderton, Oldham, OL9 9LL United Kingdom Telephone (44) 161 622 4444 Fax: (44) 161 622 4446 hq@zetex.com These offices are supported by agents and distributors in major countries world-wide. This publication is issued to provide outline information only which (unless agreed by the Company in writing) may not be used, applied or reproduced for any purpose or form part of any order or contract or be regarded as a representation relating to the products or services concerned. The Company reserves the right to alter without notice the specification, design, price or conditions of supply of any product or service. For the latest product information, log on to www.zetex.com ISSUE 1 - OCTOBER 2005 7 SEMICONDUCTORS 1 |
Price & Availability of ZXMD63N03X05
 |
|
|
|
|
All Rights Reserved © IC-ON-LINE 2003 - 2022 |
| [Add Bookmark] [Contact Us] [Link exchange] [Privacy policy] |
|
Mirror Sites : [www.datasheet.hk]
[www.maxim4u.com] [www.ic-on-line.cn]
[www.ic-on-line.com] [www.ic-on-line.net]
[www.alldatasheet.com.cn]
[www.gdcy.com]
[www.gdcy.net] |